Ecofrec™ TF 37 InventecFlux 2-TF may be used for

2-TF may be used for BGA sphere attachment and reballing

Test Requirement

L: <1 decade drop (cleaned) Surface Insulation Resistance 40 °C

Clear residue

AMTECH spheres also exceed both IPC and MIL standards for purity levels and size tolerances

Ecofrec™ TF 37 InventecFlux 2-TF may be used forTechnical Data Sheet Safety Data Sheet ECOFREC TF37 & ECOFREC TF37I are tacky flux designed for soldering and rework of traditional components and SMDs. Tacky fluxes ECOFREC TF37 & ECOFREC TF37I allow metal free soldering of SMDs on PCBs, the PCBs' solder pads being covered by about 100 microns of metal solid solder deposit (SSD technology such as SIPAD etc). Designed for this technology, ECOFREC TF37 & ECOFREC TF37I exhibit good printing behavior.