XC4VLX40-11FFG668C Compact Package: 1152-FBGA (35x35mm) footprint

Compact Package: 1152-FBGA (35x35mm) footprint optimizes board space

26V Mounting Type Surface Mount Operating Temperature -40°C ~ 125°C (TJ) Grade Automotive Qualification AEC-Q100 Package / Case 484-FBGA

The device's combination of logic density

Compact 100-VQFP Package - Space-saving 14x14mm footprint ideal for dense PCB layouts

Explore our complete range of FPGAs - Field Programmable Gate Array ICs for high-speed processing solutions across various logic densities and package types

XC4VLX40-11FFG668C Compact Package: 1152-FBGA (35x35mm) footprintProduct attributes Property Value Manufacturer AMD Product Series Virtex 4 LX Packaging Tray Tray Number of LABs CLBs 4608 Number of Logic Elements Cells 41472 Total RAM Bits 1769472 Number of I O 448 Number of Gates Voltage Supply 1. 14V ~ 1. 26V Mounting Type Surface Mount Operating Temperature 0C ~ 85C (TJ) Grade Qualification Package Case 668 BBGA, FCBGA Supplier Device Package 668 FCBGA (27x27) ROHS